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Call for Papers

ACDDE 2016

posted Mar 8, 2016, 9:51 PM by Byounghyun Yoo

Important Dates

Abstract submission May 6
Abstract acceptance notification May 13
Full paper submission for review June 10
Paper acceptance notification July 29
Final paper submission August 19
Presentation slide submission

Web3D 2016

posted Mar 3, 2016, 10:43 PM by Byounghyun Yoo

***** Web3D 2016 CALL FOR PAPERS *****

Web3D 2016 Conference - Anaheim, California, USA -  22-24 July 2016

Deadline for Paper submissions: 15 April, 2016 – Time zone UTC/GMT-12

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The 21st International Conference on 3D Web Technology (Web3D 2016). Co-located and Sponsored by ACM SIGGRAPH in co-operation with Web3D ConsortiumWeb3D 2016 conference will address an extensive range of research and application topics related to interactive 3D content in a wide range of web environments, including virtual and augmented reality (VR & AR) and 3D printing. This year’s theme “3D for All” emphasizes the importance of research and development enabling the use of 3D technology in various application domains, including medicine, industry, education, and geographical information systems as well as other emerging, alternative, or underexplored fields.


Papers presenting original work in Web3D research and application may be submitted in long or short form (up to 9 or 4 pages). Submissions will be peer-reviewed; accepted papers will be included in the ACM Digital Library and submitted for indexing in Web of Science, DBLP, and Scopus.

A pdf version of the CFP is available here.


Details for papers, posters, tutorials, workshops, showcases, industrial use cases and competition submissions are at the links below:

·        General InstructionsPapersPostersTutorialsWorkshopsShowcasesIndustrial Use CasesH-Anim 3D Animated Music Video Competition.


Important Dates: Conference dates: 22-24 July 2016

·        Papers Submission Deadline: 15 April 2016

·        Tutorials Submission Deadline: 1 May 2016

·        Workshops Submission Deadline: 1 May 2016

·        Competition Submission Deadline: 1 May 2016

·        Industrial Use Cases Submission Deadline: 10 May 2016

·        Conference Registration Deadlines:

Early: 15 May 2016

Regular: 21 June 2016

Three-Dimensional Wireless Ad Hoc and Sensor Networks 2016

posted Mar 1, 2016, 7:02 PM by Byounghyun Yoo   [ updated Mar 3, 2016, 4:19 PM ]

Journal: International Journal of Distributed Sensor Networks

Manuscript Due: Friday, 15 April 2016

CoverageScience Citation Index Expanded


Three-Dimensional Wireless Ad Hoc and Sensor Networks 2016

Call for Papers

Both wireless ad hoc and sensor networks have brought us new possibilities to utilize useful information around the environments. Since most of the current research work on these networks focused on two-dimensional spaces, they cannot be considered in three-dimensional fields including space, atmosphere, or ocean.

While moving towards three-dimensional networks, a number of important issues have to be addressed. First, the technologies used in two-dimensional spaces should be modified or extended. This change ranges from the mechanism to deal with position information to communication protocols. Secondly, this modification should not hinder compatibility with nodes in existing two-dimensional networks. Besides two major requirements, other research challenges including three-dimensional network coverage and deployment must be carefully addressed. This special issue attracts original research and review articles on recent development and ideas in three-dimensional wireless ad hoc and sensor networks.

Potential topics include, but are not limited to:

  • New emerging applications in three-dimensional networks
  • Network coverage and node placement in three-dimensional networks
  • MAC, routing, and transport protocol for three-dimensional networks
  • Targets tracking for three-dimensional wireless ad hoc and sensor networks
  • Synchronization and localization
  • Energy efficient and power control
  • Modeling and simulation
  • Cooperative communications for nodes in two-dimensional networks
  • Networks architecture for three-dimensional networks

Authors can submit their manuscripts via the Manuscript Tracking System at

Manuscript DueFriday, 15 April 2016
First Round of ReviewsFriday, 8 July 2016
Publication DateFriday, 2 September 2016

Lead Guest Editor

  • Ki-Il Kim, Gyeongsang National University, Jinju, Republic of Korea

Guest Editors

  • Babar Shah, Zayed University, Dubai, UAE
  • Euisin Lee, Chungbuk National University, Cheongju, Republic of Korea
  • Soo C. Park, Department of Electronic and Computer Engineering Hong Kong University of Science and Technology, Hong Kong

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