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Three-Dimensional Wireless Ad Hoc and Sensor Networks 2016

posted Mar 1, 2016, 7:02 PM by Byounghyun Yoo   [ updated Mar 3, 2016, 4:19 PM ]
Journal: International Journal of Distributed Sensor Networks

Manuscript Due: Friday, 15 April 2016

CoverageScience Citation Index Expanded


Three-Dimensional Wireless Ad Hoc and Sensor Networks 2016

Call for Papers

Both wireless ad hoc and sensor networks have brought us new possibilities to utilize useful information around the environments. Since most of the current research work on these networks focused on two-dimensional spaces, they cannot be considered in three-dimensional fields including space, atmosphere, or ocean.

While moving towards three-dimensional networks, a number of important issues have to be addressed. First, the technologies used in two-dimensional spaces should be modified or extended. This change ranges from the mechanism to deal with position information to communication protocols. Secondly, this modification should not hinder compatibility with nodes in existing two-dimensional networks. Besides two major requirements, other research challenges including three-dimensional network coverage and deployment must be carefully addressed. This special issue attracts original research and review articles on recent development and ideas in three-dimensional wireless ad hoc and sensor networks.

Potential topics include, but are not limited to:

  • New emerging applications in three-dimensional networks
  • Network coverage and node placement in three-dimensional networks
  • MAC, routing, and transport protocol for three-dimensional networks
  • Targets tracking for three-dimensional wireless ad hoc and sensor networks
  • Synchronization and localization
  • Energy efficient and power control
  • Modeling and simulation
  • Cooperative communications for nodes in two-dimensional networks
  • Networks architecture for three-dimensional networks

Authors can submit their manuscripts via the Manuscript Tracking System at

Manuscript DueFriday, 15 April 2016
First Round of ReviewsFriday, 8 July 2016
Publication DateFriday, 2 September 2016

Lead Guest Editor

  • Ki-Il Kim, Gyeongsang National University, Jinju, Republic of Korea

Guest Editors

  • Babar Shah, Zayed University, Dubai, UAE
  • Euisin Lee, Chungbuk National University, Cheongju, Republic of Korea
  • Soo C. Park, Department of Electronic and Computer Engineering Hong Kong University of Science and Technology, Hong Kong